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datasheet - mar. 2013 - v2 tmd3782 C 1 tmd3782 datasheet - mar. 2013 - v2 color light-to-digital converter with proximity sensing the tmd3782x device will perform color temperature measurement, ambient light sensing (als) and proximity detection with background light rejection. the device detects light intensity under a variety of lighting conditions and through a variety of attenuation materials, including dark glass. the proximity detection feature allows a large dynamic range of operation for accurate distance detection, such as in a cell phone when the user positions the phone close to their ear. ir led sink current is factory trimmed to provide consistent proximity response without requiring custom er calibrations. an internal state machine provides the ability to put the device into a low power state between proximity and rgbc measurements providing very low average power consumption. the color sensing feature is useful in applications such as backlight control, solid state lighting, reflected led color sampler, or fluorescent light color temperature detection. the integrated ir blocking filter makes this device an excellent ambient light sensor, color temperature monitor, and general purpose color sensor. figure tmd3782 C 1: key benefits and features benefit feature single device integrated optical solution rgb, ambient light sensor (als) and proximity support ? power management features ?i 2 c fast mode interface compatible ?integral ir led ? small 8 lead optical module color temperature and ambient light sensing ? uv / ir blocking filters ? programmable gain & integration time ? 1,000,000:1 dynamic range equal response to 360o incident light circular segmented rgbc photodiode ideal for operation behind dark glass very high sensitivity proximity detection with integrated ir led ? background ambient light rejection ? factory trimmed, consistent response ? programmable current sink for ir led drive general description
tmd3782 C 2 datasheet - mar. 2013 - v2 the tmd3782 applic ations include: ? ambient light sensing ? color temperature sensing ? cell phone touch screen disable ? mechanical switch replacement ? industrial process control ? medical diagnostics figure tmd3782 C 2: block diagram applications
datasheet - mar. 2013 - v2 tmd3782 C 3 the tmd3782 is a digital color light sensor device containing four analog-to-digital converters (adcs) that integrate currents from photodiodes. multiple photodiode segments for red, green, blue, and clear are geometrically arranged to reduce the reading variance as a function of the incident light angle. integration of all color sensing channels occurs simultaneously. upon completion of the conversion cycle, the result is transferred to the corresponding data registers. the transfers are double-buffered to ensure that the integrity of the data is maintained. communication with the device is accomplished through a fast (up to 400 khz), two-wire i 2 c serial bus for easy connection to a microcontroller or embedded controller. the tmd3782 provides a separate pin for level-style interrupts. when interrupts are enabled and a pre-set value is exceeded, the interrupt pin is asserted and re mains asserted until cleared by the controlling firmware. the interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity or proximity value. an interrupt is generated when the value of a clear channel or proximity conversion equals or exceeds either an upper or lower threshold. in addition, a programmable interrupt persistence feature allows the user to determine how many consecutive samples must equal or exceed the threshold to trigger an interrupt. interrupt thresholds and persistence settings are configured independently for both the clear channel and proximity sensors. proximity detection is done using a dedicated proximity photodiode centrally located beneath an internal lens, an internal led, and a driver circuit. the driver circuit requires no external components and is trimmed to provide a calibrated proximity response. customer calibrations are usually not required. the number of proximity led pulses can be programmed from 1 to 255 pulses, providing a 2000:1 contiguous dynamic range. background ambient light is subtracted from the proximity reading to improve accuracy in all lighting conditions. a state machine controls the functionality. enabling bits independently determine whether the proximity, wait or rgbc / als functions are performed. average power consumption is managed via control of variable endurance low power wait cycles. once initiated the state machine will run continuously until disabled. detailed description
tmd3782 C 4 datasheet - mar. 2013 - v2 t he tmd3782 pin assignments are described below. figure tmd3782 C 3: pin diagram figure tmd3782 C 4: pin description figure tmd3782 C 5: ordering information ? contact ams for availability. package module - 8 (top view) package drawing is not to scale. pin number pin name typ description 1 v dd pwr supply voltage 2scl i i 2 c serial clock input termin al - clock signal for i 2 c serial data. 3 gnd gnd power supply ground. all voltages are referenced to gnd. 4 leda pwr led anode. 5 ledk - led cathode. connect to ldr pin when using internal driver circuit. 6 ldr - proximity ir led controlled current sink driver. 7 int o interrupt open drain (active low) 8sda i/o i 2 c serial data i/o terminal - serial data i/o for i 2 c. ordering code address interface delivery form tmd37821 0x39 i 2 c v bus = v dd interface module-8 tmd37823 0x39 i 2 c bus = 1.8v interface module-8 TMD37825 ? 0x29 i 2 c v bus = v dd interface module-8 tmd37827 ? 0x29 i 2 c bus = 1.8v interface module-8 pin assignment ordering information
datasheet - mar. 2013 - v2 tmd3782 C 5 stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only. functional operation of the device at these or any other conditions beyond those indicated under operating conditions is not im plied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. figure tmd3782 C 6: absolute maximum ratings notes: 1. all voltages are with respect to gnd. 2. maximum 4.8v dc over 7 years lifetime maximum 5.0v spikes with up to 250s cumu lative duration over 7 years lifetime maximum 5.5v spikes with up to 10s (=1000*10ms) cumulative duration over 7 years lifetime 3. maximum voltage with ldr = off all limits are guaranteed. the parameters with min and max values are guaranteed with production tests or sqc (statistical quality control) methods. figure tmd3782 C 7: recommended operating conditions note: 1. while the device is operational across the temperature range, functionality will va ry with temperature. specifications are stated only at 25c unless otherwise noted. parameter min max units comments supply voltage, v dd 3.8 v all voltages are with respect to gnd digital i/o voltage (except ldr) -0.5 3.8 v max leda voltage (note 2) 4.8 v max ldr voltage (note 3) 4.4 v output terminal current (except ldr) -1 20 ma storage temperature range, t stg -40 85 oc esd tolerance, human body model 2000 v symbol parameter min typ max units v dd supply voltage 2.7 3 3.3 v t a operating free-air temperature (note 1) -30 85 oc absolute maximum ratings electrical characteristics
tmd3782 C 6 datasheet - mar. 2013 - v2 figure tmd3782 C 8: operating characteristics, v dd =3v, t a =25oc (unless otherwise noted) symbol parameter conditions min typ max units i dd supply current active - ldr pulses off 235 330 a wait state 65 sleep state no i 2 c activity 2.5 10 v ol int, sda output low voltage 3 ma sink current 6 ma sink current 0 0 0.4 0.6 v i leak leakage current, sda, scl, int pins -5 5 a i leak leakage current, ldr pin -10 10 a v ih scl, sda input high voltage tmd37821 tmd37823 0.7 v dd 1.25 v v il scl, sda input low voltage tmd37821 tmd37823 0.3 v dd 0.54 v
datasheet - mar. 2013 - v2 tmd3782 C 7 figure tmd3782 C 9: optical characteristics (clear channel), v dd = 3v, t a = 25oc, again = 16x, atime = 0xf6 figure tmd3782 C 10: optical characteristics (rgbc), v dd = 3v, t a = 25oc notes: 1. the 465 nm input irradiance is supplied by an ingan light-emitting diode with the following characteristics: dominant wavelength d = 465 nm, spectral halfwidth ?? = 22 nm. 2. the 525 nm input irradiance is supplied by an ingan light-emitting diode with the following characteristics: dominant wavelength d = 525 nm, spectral halfwidth ?? = 35 nm. 3. the 615 nm input irradiance is supplied by a alingap ligh t-emitting diode with the following characteristics: dominant wavelength d = 615 nm, spectral halfwidth ?? = 15 nm. parameter test conditions clear channel unit min typ max r e irradiance responsivity d = 465 nm (note 1) 9.4 11.8 14.2 count/ (w/cm 2 ) d = 525 nm (note 2) 12.5 15.6 18.7 d = 615 nm (note 3) 14.6 18.2 21.8 parameter test conditions clear channel red channel green channel blue channel min max min max min max color adc count value ratio: color/clear d = 465 nm (note 1) 0% 15% 10% 42% 70% 90% d = 525 nm (note 2) 4% 25% 60% 85% 10% 45% d = 615 nm (note 3) 80% 110% 0% 14% 5% 24%
tmd3782 C 8 datasheet - mar. 2013 - v2 figure tmd3782 C 11: rgbc characteristics, v dd = 3 v, t a = 25oc, again = 16x, aen = 1 (unless otherwise noted) notes: 1. based on typical 3-sigma distribution. not 100% tested. 2. clear channel response to a red led li ght source with a dominant wavelength ( d ) of 615 nm and a spectral halfwidth (??) of 20 nm. figure tmd3782 C 12: proximity characteristics, v dd = 3 v, t a = 25oc, pen = 1 (unless otherwise noted) notes: 1. value is factory adjusted to meet the prox count specification. considerable vari ation (relative to the typical value) is p ossible after adjustment. 2. proximity offset is the sum of optica l and electrical offsets, and will change from one design implementation (or test syst em) to another. 3. ileda is factory calibrated to achieve this specification. o ffset and crosstalk directly sum with this value and is system dependent. 4. no glass or aperture above the module. tested value is the average of 5 consecutive readings. parameter conditions channel min typ max units dark adc count value e e = 0, again = 60x, atime=0xd6 (100ms) 013counts 01 counts (note 1) adc integration time step size atime = 0xff 2.25 2.38 2.53 ms adc number of integration steps 1 256 steps adc counts per step 0 1023 counts adc count value atime = 0xc0 (152.3 ms) 0 65535 counts gain scaling, relative to 1 gain setting (note 2) again = 4x again = 16x again = 60x 3.8 15 58 4.0 16 60 4.2 17 63 parameter conditions min typ max units i dd supply current ldr pulse on 3 ma adc conversion time step size 2.25 2.38 2.53 ms led pulse period 14 us led pulse width led on time 6.3 us nominal led drive current (measured at ldr=0.6v) (note 1) pdrive = 0 (100%) pdrive = 1 (50%) pdrive = 2 (25%) pdrive = 3 (12.5%) 100 50 25 12.5 ma proximity offset, no target (note 2) ppulse = 8 pdrive = 0 100 counts prox count, 100-mm target (minus proximity offset, no target value) (note 3, 4) 73 mm 83 mm, 90% reflective kodak gray card, ppulse = 8, pdrive = 0, (note 3) 350 420 490 counts
datasheet - mar. 2013 - v2 tmd3782 C 9 figure tmd3782 C 13: ir led characteristics, v dd = 3 v, t a = 25oc figure tmd3782 C 14: wait characteristics, v dd = 3 v, t a = 25oc, wen = 1 (unless otherwise noted) symbol parameter conditions min typ max units v f forward voltage i f = 20 ma 1.4 1.5 v v r reverse voltage i r = 10 a 5v p o radiant power i f = 20 ma 4.5 mw p peak wavelength i f = 20 ma 850 nm spectral radiation bandwidth i f = 20 ma 40 nm t r , t f optical rise, r fall time i f = 100 ma, t w = 125 ns, duty cycle = 25% 20 40 ns parameter conditions channel min typ max units wait step size wtime = 0xff 2.25 2.38 2.53 ms
tmd3782 C 10 datasheet - mar. 2013 - v2 the timing characteristics of tmd3782 are given below. figure tmd3782 C 15: ac electrical characteristics, v dd = 3 v, t a = 25oc (unless otherwise noted) ? specified by design and characterization; not production tested. figure tmd3782 C 16: parameter measurement information parameter ? description min typ max units f (scl) clock frequency (i 2 c only) 0400khz t (buf) bus free time between start and stop condition 1.3 s t (hdsta) hold time after (repeated) start condition. after this period, the first clock is generated. 0.6 s t (susta) repeated start condition setup time 0.6 s t (susto) stop condition setup time 0.6 s t (hddat) data hold time 0 s t (sudat) data setup time 100 ns t (low) scl clock low period 1.3 s t (high) scl clock high period 0.6 s t f clock/data fall time 300 ns t r clock/data rise time 300 ns c i input pin capacitance 10 pf timing characteristics timing diagrams
datasheet - mar. 2013 - v2 tmd3782 C 11 figure tmd3782 C 17: spectral responsivity figure tmd3782 C 18: normalized i dd vs. v dd and temperature typical operating characteristics
tmd3782 C 12 datasheet - mar. 2013 - v2 figure tmd3782 C 19: typical ldr current vs. voltage figure tmd3782 C 20: rgbc responsivity vs. angular displacement green led both axes
datasheet - mar. 2013 - v2 tmd3782 C 13 figure tmd3782 C 21: proximity responsivity vs. angular displacement figure tmd3782 C 22: responsivity temperature coefficient 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% -30 -20 -10 0 10 20 30 response angle relative to perpendicular proximity normalized angular response
tmd3782 C 14 datasheet - mar. 2013 - v2 interface and control are accomplished through an i 2 c serial compatible interface (standard or fast mode) to a set of registers that provide access to device cont rol functions and output data. the devices support the 7-bit i 2 c addressing protocol. the i 2 c standard provides for three types of bus transaction: read, write, and a combined prot ocol (figure tmd3782 - 23). during a write operation, the first byte written is a command byte followed by data. in a combined protocol, the first byte written is the command byte followed by reading a series of bytes. if a read command is issued, the register address from the previous command will be used for data access. likewise, if the msb of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. the command byte contains either control information or a 5-bit register address. the control commands can also be used to clear interrupts. the i 2 c bus protocol was developed by philips (now nxp). for a complete description of the i 2 c protocol, please review the nxp i 2 c design specification at http://www.i2c-bus.org/references/. figure tmd3782 C 23: i 2 c write, read and combined protocols i 2 c protocol acknowledge (0) not acknowledged (1) stop condition read (1) start condition a n p r s repeated start condition write (0) continuation of protocol master - to - slave slave -to -master sr w
datasheet - mar. 2013 - v2 tmd3782 C 15 the tmd3782 is controlled and monitored by data registers and a command register accessed through the serial interface. these registers provide for a variety of control functions and can be read to determine results of the adc conversions. the register set is summarized in figure tmd3782 - 24. figure tmd3782 C 24: register map address register name r/w register function reset value - command w specified register address 0x00 0x00 enable r/w enables states and interrupts 0x00 0x01 atime r/w rgbc time 0xff 0x03 wtime r/w wait time 0xff 0x04 ailtl r/w clear interrupt low threshold low byte 0x00 0x05 ailth r/w clear interrupt low threshold high byte 0x00 0x06 aihtl r/w clear interrupt high threshold low byte 0x00 0x07 aihth r/w clear interrupt high threshold high byte 0x00 0x08 piltl r/w proximity interrupt low threshold low byte 0x00 0x09 pilth r/w proximity interrupt low threshold high byte 0x00 0x0a pihtl r/w proximity interrupt high threshold low byte 0x00 0x0b pihth r/w proximity interrupt high threshold high byte 0x00 0x0c pers r/w interrupt persistence filters 0x00 0x0d config r/w configuration 0x00 0x0e ppulse r/w proximity pulse count 0x00 0x0f control r/w gain control register 0x00 0x11 revision r die revision number rev. 0x12 id r device id id 0x13 status r device status 0x00 0x14 cdata r clear adc low data register 0x00 0x15 cdatah r clear adc high data register 0x00 0x16 rdata r red adc low data register 0x00 0x17 rdatah r red adc high data register 0x00 0x18 gdata r green adc low data register 0x00 register description
tmd3782 C 16 datasheet - mar. 2013 - v2 the mechanics of accessing a spec ific register depends on the specific protocol used. in general, the command register is written first to specify the specific control/status register for following read/write operations. 0x19 gdatah r green adc high data register 0x00 0x1a bdata r blue adc low data register 0x00 0x1b bdatah r blue adc high data register 0x00 0x1c pdata r proximity adc low data register 0x00 0x1d pdatah r proximity adc high data register 0x00 address register name r/w register function reset value
datasheet - mar. 2013 - v2 tmd3782 C 17 the command registers specifie s the address of the target register for future write and read operations, and is used to clear interrupt sources. figure tmd3782 C 25: command register 76543210 command type add fields bits description command 7 select command register. must write as 1 when addressing command register. type 6:5 selects type of transaction to fo llow in subsequent data transfers: field value transaction type 00 repeated byte protocol transaction 01 auto-increment protocol transaction 10 reserved do not use 11 special function see description below byte protocol will repeatedly read the same register with each data access. block protocol will provide auto-increment function to read successive bytes. add 4:0 address field/special function field. depend ing on the transaction type, see above, this field either specifies a special fu nction command or selects the specific control?status?register for following write and read transactions. the field values listed below apply only to special function commands: field value special function 00000 normal no action 00101 proximity interrupt clear 00110 clear channel interrupt clear 00111 proximity and clear interrupt clear other reserved do not write clear channel/proximity interrupt clear. clears any pending clear/proximity interrupt. this special function is self clearing. command register
tmd3782 C 18 datasheet - mar. 2013 - v2 the system state machine shown in figure tmd3782 - 26 provides an overview of the states and state transitions that provide system control of the device. this section highlights the programmable features, which affect the state machine cycle time, and provides details to determine system level timing. when the proximity detection feature is enabled (pen), the state machine transitions through the prox accum, prox wait, and prox adc states. the prox wait time is a fixed 2.4 ms, whereas the prox accum time is determined by the number of proximity led pulses (ppulse) and the prox adc time is determined by the integration ti me (ptime). the formulas to determine the prox accum and prox adc times are given in the associated boxes in figure tmd3782 - 26. if an interrupt is generated as a result of the proximity cycle, it will be asserted at the end of the prox adc state. when the power management feature is enabled (wen), the state machine will transition in turn to the wait state. the wait time is determined by wlong, which extends normal operation by 12 when asserted, and wtime. the formula to determine the wait time is given in the bo x associated with the wait state in figure tmd3782 - 26. when the rgbc feature is enabled (aen), the state machine will transition through the rgbc init and rgbc adc states. the rgbc init state takes 2.4 ms, while the rgbc adc time is dependent on the integration time (atime). the formula to determine rgbc adc time is given in the associated box in figure tmd3782 - 26. if an interrupt is generated as a result of the rgbc cycle, it will be asserted at the end of the rgbc adc. figure tmd3782 C 26: enhanced state machine diagram notes: 1. there is a 2.4 ms warm-up delay if pon is enabled. if pon is not enabled, the device will return to the sleep state as show n. 2. pon, pen, wen and aen are fields in the enable register (0x00). 3. pon=1, pen-1, wen-1, aen=0 is unsupported and will lead to errone ous proximity readings. system timing
datasheet - mar. 2013 - v2 tmd3782 C 19 the enable register is used pr imarily to power the device on and off, and enable functions and interrupts. figure tmd3782 C 27: enable register. notes: 1. the pon bit must also be set=1 for these functions to operate. 2. wen=1, pen=1, aen=0 is unsupported an d will lead to erroneous proximity readings. 76543210 reserved pien aien wen pen aen pon field bits description (reset value = 0x00) reserved 7:6 reserved. write as 0. pien 5 proximity interrupt enable. when asserted permits proximity interrupts to be generated, subject to the persist filter. aien 4 ambient light sensing (als) interrupt enable. when asserted permits als interrupts to be generated, su bject to the persist filter. wen (note 1,2) 3 wait enable. this bit activates the wait feature. writing a 1 activates the wait timer. writing a 0 disables the wait timer. pen (note 1,2) 2 proximity enable. this bit activates the proximity function. writing a 1 enables proximity. writing a 0 disables proximity. aen (note 1,2) 1 adc enable. this bit activates the fo ur-channel (rgbc) adc. writing a 1 enables the adc. writin g a 0 disables the adc. pon 0 power on. this bit activates the internal oscillator to permit the timers and adc channels to operate. writing a 1 activates the oscillator. writing a 0 disables the oscillator. during reads and writes over the i 2 c interface, this bit is temporarily overridden and the oscilla tor is enabled, independent of the state of pon. enable register (0 x 00)
tmd3782 C 20 datasheet - mar. 2013 - v2 the rgbc timing register controls the internal integration time of the rgbc channel adcs. upon power up, the rgbc time register is set to 0xff. the maximum (or saturation) count value can be calculated based upon the integration time cycles as follows: min [cycles * 1024, 65535] figure tmd3782 C 28: rgbc integration time register wait time is set in 2.38 ms in crements unless the wlong bit is asserted in which case the wait times are 12 longer. wtime is programmed as a 2s complement number. figure tmd3782 C 29: wait time register note: the wait time register should be config ured before aen and/or pen is asserted. field bits description (reset value = 0xff) atime 7:0 value cycles time max count 0xff 1 2.38 ms 1024 0xf6 10 24 ms 10240 0xd6 42 100 ms 43008 0xad 64 152 ms 65535 0x00 256 609 ms 65535 field bits description (reset value = 0xff) wtime 7:0 register value wait time time (wlong=0) time (wlong=1) 0xff 1 2.38 ms 0.03 sec 0xab 85 202 ms 2.43 sec 0x00 256 609 ms 7.31 sec rgbc integration time register (0x01) wait time register (0x03)
datasheet - mar. 2013 - v2 tmd3782 C 21 the clear channel interrupt threshold registers provide 16 bit values to be used as the high and low thresholds for comparison to the 16 bit cdata values. if aien (r0x00:b4) is enabled and cdata is not between ailt and aiht for the number of consecutive samples specified in apers (r0x0c) an interrupt is asserted on the interrupt pin. figure tmd3782 C 30: clear channel interrupt threshold registers the proximity interrupt threshold registers provide 16 bit values to be used as the high and low thresholds for comparison to the 16 bit pdata values. if pien (r0x00:b5) is enabled and pdata is not between pilt and piht for the number of consecutive samples specified in ppers (r0x0c) an interrupt is asserted on the interrupt pin. figure tmd3782 C 31: proximity interrupt threshold registers registers address bits description (reset value = 0x00) ailtl 0x04 7:0 als low threshold lower byte ailth 0x05 7:0 als low threshold upper byte aihtl 0x06 7:0 als high threshold lower byte aihth 0x07 7:0 als high threshold upper byte registers address bits description (reset value = 0x00) piltl 0x08 7:0 proximity low threshold lower byte pilth 0x09 7:0 proximity low threshold upper byte pihtl 0x0a 7:0 proximity high threshold lower byte pihth 0x0b 7:0 proximity high threshold upper byte clear channel interrupt threshold register (0x04 - 0x0b) proximity interrupt threshold register (0x04 - 0x0b)
tmd3782 C 22 datasheet - mar. 2013 - v2 the interrupt register controls the interrupt capabilities of the device. figure tmd3782 C 32: interrupt persistence register. 76543210 ppers apers field bits description (reset value = 0x00) ppers 7:4 proximity interrupt persistence. controls rate of proximity interrupts to the host processor. field values persistence 0000 every proximity cycle generates an interrupt 0001 any value outside of threshold range 0010 2 consecutive values out of range . . 1111 15 consecutive values out of range apers 3:0 clear channel interrupt persistence. controls rate of clear channel interrupts to the host processor. field value persistence 0000 every rgbc cycle generates an interrupt 0001 any value outside of threshold range 0010 2 consecutive values out of range 0011 3 consecutive values out of range 0100 5 consecutive values out of range 0101 10 consecutive values out of range 0110 15 consecutive values out of range 0111 20 consecutive values out of range 1000 25 consecutive values out of range 1001 30 consecutive values out of range 1010 35 consecutive values out of range 1011 40 consecutive values out of range 1100 45 consecutive values out of range 1101 50 consecutive values out of range 1110 55 consecutive values out of range 1111 60 consecutive values out of range interrupt persistence register (0x0c)
datasheet - mar. 2013 - v2 tmd3782 C 23 the configuration register sets the wait long time. figure tmd3782 C 33: configuration register. the proximity pulse count register sets the number of proximity pulses that will be transmitted. figure tmd3782 C 34: proximity pulse count register. 76543210 reserved wlong reserved field bits description (reset value = 0x00) reserved 7:2 reserved. write as 0. wlong 1 wait long. when asserted, the wait cycles are increased by a factor 12 from that programmed in the wtime register. reserved 0 reserved. write as 0. field bits description (reset value = 0x00) ppulse 7:0 proximity pulse count. specifies the number of proximity pulses to be generated. configuration register (0x0d) proximity pulse count register (0x0e)
tmd3782 C 24 datasheet - mar. 2013 - v2 the control register provides rgbc gain settings and a control for managing the proximity reading in the event the analog circuitry becomes saturated. bit 5 must be set =1 for proper device operation. figure tmd3782 C 35: control register. the id register provides the die revision. this register is a read-only register. figure tmd3782 C 36: revision register 76543210 pdrive reserved psat reserved again field bits description (reset value = 0x00) pdrive 7:6 00 = 100% 01 = 50% 10 = 25% 11 = 12.5% reserved 5 reserved. must be written = 1 psat 4 0 = pdata output regardless of ambient light level 1 = pdata output equal to dark current value if saturated reserved 3:2 reserved. write as 00 again 1:0 rgbc gain control. field value rgbc gain value 00 1x gain 01 4x gain 10 16x gain 11 60x gain field bits description (reset value = rev) reserved 7:3 reserved rev 2:0 die revision control register (0x0f) revision register (0x11)
datasheet - mar. 2013 - v2 tmd3782 C 25 the id register provides the value for the part number. this register is a read-only register. figure tmd3782 C 37: id register the status register provides the internal status of the device. this register is read only. figure tmd3782 C 38: status register. field bits description (reset value = id) id 7:0 part number identification. 0x60 = tmd37821 0x69 = tmd37823 76543210 reserved pint aint reserved pvalid avalid field bits description (reset value = 0x00) reserved 7:6 reserved. pint 5 proximity interrupt. aint 4 ambient light sensor (als) interrupt. reserved 3:2 reserved. pvalid 1 indicates that a proximity cycle has completed since pen was asserted. avalid 0 indicates that the rgbc cycle has completed since aen was asserted. id register (0x12) status register (0x13)
tmd3782 C 26 datasheet - mar. 2013 - v2 clear, red, green, and blue data is stored as 16-bit values. to ensure the data is read correctly, a two-byte read i 2 c transaction should be used with a read word protocol bit set in the command register. with this operation, when the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent read to the upper byte. the upper register will read the correct value even if additional adc integration cycles end betw een the reading of the lower and upper registers. figure tmd3782 C 39: rgbc data registers. proximity data is stored as a 16-bit value. to ensure the data is read correctly, a two-byte read i 2 c transaction should be used with a read word protocol bit se t in the command register. with this operation, when the lower byte register is read, the upper eight bits are stored into a shadow register, which is read by a subsequent read to the upper byte. the upper register will read the correct value even if additional adc integration cycles end between the reading of the lower and upper registers. figure tmd3782 C 40: proximity data registers. register address bits description (reset value = 0x00) cdatal 0x14 7:0 clear data low byte cdatah 0x15 7:0 clear data high byte rdatal 0x16 7:0 red data low byte rdatah 0x17 7:0 red data high byte gdatal 0x18 7:0 green data low byte gdatah 0x19 7:0 green data high byte bdatal 0x1a 7:0 blue data low byte bdatah 0x1b 7:0 blue data high byte register address bits description (reset value = 0x00) pdatal 0x1c 7:0 proximity data low byte pdatah 0x1d 7:0 proximity data high byte rgbc data registers (0x14 - 0x1b) proximity data registers (0x1c - 0x1d)
datasheet - mar. 2013 - v2 tmd3782 C 27 in a proximity sensing system, the ir led can be pulsed by the tmd3782 with more than 100 ma of rapidly switching current, therefore, a few design considerations must be kept in mind to get the best performance. the key goal is to reduce the power supply noise coupled back into the device during the led pulses. if v bat does not exceed the maximum specified ldr pin voltage (including when the battery is being recharged), leda can be directly tied to v bat for best proximity performance. in many systems, there is a quiet analog supply and a noisy digital supply. by connecting the quiet supply to the v dd pin and the noisy supply to the led, the key goal can be meet. place a 1-f low-esr decoupling capacitor as close as possible to the v dd pin and another at the led anode, and a 10 - 22f bulk capacitor at the output of the led voltage regulator to supply the 100-ma current surge. if operating from a single supply, use a 22- resistor in series with the v dd supply line and a 1-f low esr capacitor to filter any power supply noise. the previous capacitor placement considerations apply. figure tmd3782 C 41: typical application hardware circuit v bus in the above figure refers to the i 2 c bus voltage which is either v dd or 1 .8 v. b e su re to a p p ly th e spe cif ied i 2 c bus voltage shown in the available options table for the specific device being used. the i 2 c signals and the interrupt are open-drain outputs and require pull?up resistors. the pull-up resistor (rp) value is a function of the i 2 c bus speed, the i 2 c bus voltage, and the capacitive load. the ams evm running at 400 kbps, uses 1.5-k resistors. a 10-k pull-up resist or (rpi) can be used for the interrupt line. application information
tmd3782 C 28 datasheet - mar. 2013 - v2 suggested pcb pad layout guidelines for the surface mount module are shown. flash gold is recommended surface finish for the landing pads. figure tmd3782 C 42: suggested pcb layout notes: 1. all linear dimensions are in millimeters. 2. this drawing is subject to change without notice. pcb pad layout
datasheet - mar. 2013 - v2 tmd3782 C 29 figure tmd3782 C 43: package diagrams notes: 1. all linear dimensions are in millimeters. dimension tolerance is 0.05 mm unless otherwise noted. 2. contacts are copper with nipdau plating. 3. this package contains no lead (pb). 4. this drawing is subject to change without notice. package drawings and markings
tmd3782 C 30 datasheet - mar. 2013 - v2 the mechanical data of tmd3782 is explained below. figure tmd3782 C 44: carrier tape and reel information notes: 1. all linear dimensions are in millimeters. dimension tolerance is 0.10 mm unless otherwise noted. 2. the dimensions on this drawing are for illustrative purpos es only. dimensions of an actu al carrier may vary slightly. 3. symbols on drawing ao, bo, and ko ar e defined in ansi eia standard 481?b 2001. 4. each reel is 330 millimeters in diameter and contains 2500 parts. 5. ams packaging tape and reel conform to the requiremen ts of eia standard 481?b. 6. in accordance with eia standard, device pin 1 is located next to the sprocket holes in the tape. 7. this drawing is subject to change without notice. mechanical data
datasheet - mar. 2013 - v2 tmd3782 C 31 soldering information the package has been tested and has demonstrated an ability to be reflow soldered to a pcb substrate. the solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a pcb. temperature is measured on top of component. the components should be limited to a maximum of three passes through this solder reflow profile. figure tmd3782 C 45: solder reflow profile figure tmd3782 C 46: solder reflow profile graph parameter reference device average temperature gradient in preheating 2.5 oc/sec soak time t soak 2 to 3 minutes time above 217 oc (t1) t 1 max 60 sec time above 230 oc (t2) t 2 max 50 sec time above t peak - 10 oc (t3) t 3 max 10 sec peak temperature in reflow t peak 260 oc temperature gradient in cooling max -5 oc/sec soldering and storage information
tmd3782 C 32 datasheet - mar. 2013 - v2 storage information moisture sensitivity optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. to ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. shelf life the calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions: shelf life: 12 months ambient temperature: < 40 c relative humidity: < 90% rebaking of the devices will be required if the devices exceed the 12 month shelf life or the humidity indicator card shows that the devices were exposed to conditions beyond the allowable moisture region. floor life the module has been assigned a moisture sensitivity level of msl 3. as a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: floor life: 168 hours ambient temperature: < 30 c relative humidity: < 60% if the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. rebaking instructions when the shelf life or floor life limits have been exceeded, rebake at 50 c for 12 hours.
datasheet - mar. 2013 - v2 tmd3782 C 33 the term rohs complaint means that ams products fully comply with current rohs directive. our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that le ad not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, rohs compliant products are suitable for use in specified lead-free proc esses. ams green means rohs compliant and no sb/br). ams defines green that additionally to rohs compliance our products are free of bromine (br) and antimony (sb) based flame retard ants (br or sb do not exceed 0.1% by weight in homogeneous material). important information and di sclaimer the information provided in this statement represents ams knowledge and belief as of the date that it is provided. ams bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are unde rway to better integrate information from third parties. ams has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams and ams suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. rohs compliant and ams green statement
tmd3782 C 34 datasheet - mar. 2013 - v2 copyright ? 1997-2013, ams ag, tobelbaderstrasse 30, 8141 unterpremstaetten, austria-europe. trademarks registered ?. all rights reserved. the material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. devices sold by ams ag are covered by the warranty and patent indemnification provisions appear ing in its term of sale. ams ag makes no warranty, express, statutory, implied, or by description regarding the info rmation set forth herein or regarding the freedom of the de scribed devices from patent infringement. ams ag reserv es the right to change specifications and prices at any time and without notice. therefore, prior to designing this product into a system, it is necessary to check with ams ag for current information. this product is intended for use in normal commercial applications. applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams ag for each application. for shipments of less than 100 part s the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. the information furnished here by ams ag is believed to be correct and accurate. however, ams ag shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of ams ag rendering of technical or other services. copyrights disclaimer

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